P/N 1110748 Surface Mount-to-DIP JEDEC SOT-25, SOT-23A-6 Adapter
FEATURES * Allows for breadboarding or substitution of Microgate SOT-23A-6 and SOT-25 IC and transistor packages into 0.100 [2.54] pitch proto boards or PC boards. * Solder masked top-side pads allow user to hand solder devices directly to topside of adapter with fewer problems of solder bridging. * Longer male bottom Pins available at special request for easy use of probe clips. * Large topside pads allow for soldering test pins, jumpers, etc. to top of adapter. GENERAL SPECIFICATIONS * BOARD MATERIAL: 0.062 [1.58] thick FR-4 manufactured to IPC-600E, Class 2 standards, with 1-oz. Cu traces, both sides * PADS: HASL * PINS: Brass 360 1/2-hard per UNS C36000, ASTM B16/B16M * PIN PLATING: 200 [5.08] Sn/Pb 93/7 ASTM B579-73 over 100 [2.54] Ni per SAE-AMS-QQ-N-290 * OPERATING TEMPERATURE: 221F [105C] MOUNTING CONSIDERATIONS * SUGGESTED PCB HOLE SIZE: 0.028 0.003 [0.71 0.08] dia.
ALL DIMENSIONS: INCHES [MILLIMETERS] ALL TOLERANCES: 0.005 [0.13] UNLESS OTHERWISE SPECIFIED ALL CAC's ARE MANUFACTURED ND INSPECTED USING IPC -610B CLASS 2 GUIDELINES CONSULT FACTORY FOR MOUNTING CONSIDERATIONS OF CONSIGNED CHIPS. CONSULT FACTORY FOR OTHER SIZES AND CONFIGURATIONS
CUSTOMIZATION: In addition to the standard products shown on this page, Aries specializes in custom design and production. Special materials, platings, sizes, and configurations can be furnished, depending on the quantity. NOTE: Aries reserves the right to change product general specifications without notice.
ORDERING INFORMATION
P/N 1110748 P/N 1110748-P for Panelized Version
Bristol, PA 19007-6810 USA TEL (215) 781-9956 * FAX (215) 781-9845 WWW.ARIESELEC.COM * INFO@ARIESELEC.COM
PRINTOUTS OF THIS DOCUMENT MAY BE OUT OF DATE AND SHOULD BE CONSIDERED UNCONTROLLED
18043 Rev. AA
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